AOI (Automated Optical Inspection)In-line Bump Inspection System : In-Tray (JEDEC) Type TVI SERIES
Feature
The TVI Series are the type of in-line inspection system to measure individual substrates having on the tray (JEDEC) for measuring.
Unique technology to perform the inspection in tray and suitable especially for small and thin substrates inspection.
Applicable both for round and flattened bumps.
Specifications
| Major measurement items | Bump Height Bump Coplanarity Bump Diameter |
|
|---|---|---|
| S10210 | S10220 | |
| Field of View (FOV) | 13mm×13mm（11mm×15mm、15mm×11mm） | |
| Z-measurement range | 240μm | 240μm |
| XY Resolution | 3.0μm | 2.1μm |
| Bump Diameter(Min.) | 25μm | 18μm |
| Bump Pitch | 55μm | 36μm |
| Accuracy in Height | 3σ AVE. + 3σ 3σ ≦ 2μm | |
| Dimension | (W)3,020mm×(D)2,245mm×(H)1,800mm（参考） | |
| Basic supply and storage method | JEDEC tray | |
Download
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