AOI (Automated Optical Inspection)CVI-series / Index Type In-line Bump Inspection System CVI-S10210-RA
The CVI-RA-series in-line substrate bump inspection system measures an individualized package substrate while transferring it to the index.
Feature
The CVI series are in-line bump inspection systems that transfer individual package substrates to an index and measure them.
Since the system is an indexing type, it is relatively immune to external noise and performs individual substrate inspection at high speed while ensuring high inspection accuracy.
Regarding bump shapes, measurement is possible with both round and flattened bumps.
Inspection items/Applications
The Flip Chip C4 bumps of individualized substrates, such as MPU substrate, height of bump on an individualized substrate, substrate warpage, co-planarity inspection
Specifications
| Major measurement items | Bump Height Bump Coplanarity Bump Diameter |
|---|---|
| Field of View (FOV) | 15.0mm x 15.0mm |
| Z-measurement range | 300μm |
| XY-resolution | 3.0μm |
| Bump diameter | 25μm |
| Bump pitch | 55μm |
| Measurement repeatability (Height) | 3σ ave. + 3σ3σ ≦ 2μm |
| System size | (W)1,800mm x (D)2,900mm x (H)1,800mm |
| Basic supply and storage method | JEDEC tray |
Download
Download the catalog of CVI-series / Index Type In-line Bump Inspection System CVI-S10210-RA.