AOI (Automated Optical Inspection)TVI-series / In-tray Type In-line Bump Inspection System TVI-S7040-RA
The TVI-series in-line substrate bump inspection system measures an individualized package substrate placed on a tray (JEDEC).
Feature
The TVI series are in-line bump inspection systems that measure individual package substrates placed in a JEDEC tray.
We use our proprietary method to carry out 3D measurement that is adaptable to the placement condition of substrates, meeting the requirements of small and thin substrates.
Regarding bump shapes, measurement is possible with both round and flattened bumps.
Inspection items/Applications
The Flip Chip C4 bumps of individualized substrates, such as MPU substrate, height of bump on an individualized substrate, substrate warpage, co-planarity inspection
Specifications
| Major measurement items | Bump Height Bump Coplanarity C4 Area Warpage |
|---|---|
| Field of View (FOV) | 13.0mm×13.0mm |
| Z-measurement range | 180μm |
| XY-resolution | 3.0μm |
| Bump diameter | 25μm |
| Bump pitch | ≧90μm |
| Measurement repeatability (Height) | 3σ ave. ≦ 1μm |
| System size | (W)3,020mm×(D)2,050mm×(H)1,800mm |
| Basic supply and storage method | JEDEC tray |
Download
Download the catalog of TVI-series / In-tray Type In-line Bump Inspection System TVI-S7040-RA.