AOI (Automated Optical Inspection)Off-line Bump Inspection System : Sheet/Panel Type SVI SERIES

FVI-series / Generic 3D Inspection System

Feature

The SVI Series are systems for inspecting IC package substrates with a sheet(panel) condition.

The system has a review function with a high-resolution color camera and it is possible to identify defects after the inspection.

Capable of suction and measurement of workpieces up to 515mm × 510mm in size.

Specifications

Major measurement items Bump Height
Bump Coplanarity
Bump Diameter
S10210 S10220
Field of View (FOV) 15mm×15mm 15mm×15mm
Z-measurement range 300μm 300μm
XY Resolution 3.0μm 2.1μm
Bump Diameter(Min.) 25μm 18μm
Bump Pitch 55μm 36μm
Accuracy in Height 3σ AVE. + 3σ 3σ ≦ 2μm
Dimension (W)1,560mm×(D)2,220mm×(H)1,800mm

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