AOI (Automated Optical Inspection)Off-line Bump Inspection System : Sheet/Panel Type SVI SERIES

Feature
The SVI Series are systems for inspecting IC package substrates with a sheet(panel) condition.
The system has a review function with a high-resolution color camera and it is possible to identify defects after the inspection.
Capable of suction and measurement of workpieces up to 515mm × 510mm in size.
Specifications
Major measurement items | Bump Height Bump Coplanarity Bump Diameter |
|
---|---|---|
S10210 | S10220 | |
Field of View (FOV) | 15mm×15mm | 15mm×15mm |
Z-measurement range | 300μm | 300μm |
XY Resolution | 3.0μm | 2.1μm |
Bump Diameter(Min.) | 25μm | 18μm |
Bump Pitch | 55μm | 36μm |
Accuracy in Height | 3σ AVE. + 3σ 3σ ≦ 2μm | |
Dimension | (W)1,560mm×(D)2,220mm×(H)1,800mm |
Download
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