AOI (Automated Optical Inspection)Wafer Micro-bump Inspection System
The WVI-S8530 is the top-of-the-line system for micro-bump inspection compatible with 200 mm/300 mm wafers. This system, which achieved the highest level of high-speed and high-accuracy inspection in the industry, offers the best cost performance.
Feature
This inspection system inspects microbumps on wafers of the bump diameter class of 20 μm at high speed and with the industry’s highest accuracy.
Inspection items/Applications
Height of micro-bumps on a wafer, co-planarity of bumps, deviation of bump position, and bump existence inspection
Specifications
Major measurement items | Bump Height Bump Coplanarity Bump Diameter |
---|---|
Field of View (FOV) | 6.0mm×6.0mm |
Throughput | 4WPH for 300mm size wafer |
Z-measurement range | 88μm |
XY-resolution | 2.5μm |
Bump diameter | ≧20μm |
Bump pitch | ≧40μm |
Measurement repeatability (Height) | 3σ ave. ≦ 0.2μm |
System size | TBA |
Download
Download the catalog of Wafer Micro-bump Inspection System.