AOI (Automated Optical Inspection)In-line Bump Inspection System with Vacuum Function (For Individual Substrate) EVI SERIES

The EVI Series are in-line bump inspection system that the next-generation substrate on the tray (JEDEC) transferred onto a jig and achieves high accuracy and high speed measurement.
Feature
The EVI Series are system optimizes the work transfer with double-shuttle system and Z measurement range,and achieves high accuracy and high throughput with the new technology.
Applicable both for round and flattened bumps.
Specifications
Major measurement items | Bump Height Bump Coplanarity Bump Diameter |
|
---|---|---|
S10210 | S10220 | |
Field of View (FOV) | 15mm×15mm | 15mm×15mm |
Z-measurement range | 300μm | 300μm |
XY Resolution | 3.0μm | 2.1μm |
Bump Diameter(Min.) | 25μm | 18μm |
Bump Pitch | 55μm | 36μm |
Accuracy in Height | 3σ AVE. + 3σ 3σ ≦ 2μm | |
Dimension | (W)2,560mm×(D)2,715mm×(H)1,945mm |
Download
Download the catalog of In-line Bump Inspection System with Vacuum Function (For Individual Substrate) EVI SERIES.