AOI (Automated Optical Inspection)In-line Bump Inspection System with Vacuum Function (For Individual Substrate) EVI SERIES

CVI-series / Index Type In-line Bump Inspection System

The EVI Series are in-line bump inspection system that the next-generation substrate on the tray (JEDEC) transferred onto a jig and achieves high accuracy and high speed measurement.

Feature

The EVI Series are system optimizes the work transfer with double-shuttle system and Z measurement range,and achieves high accuracy and high throughput with the new technology.

Applicable both for round and flattened bumps.

Specifications

Major measurement items Bump Height
Bump Coplanarity
Bump Diameter
S10210 S10220
Field of View (FOV) 15mm×15mm 15mm×15mm
Z-measurement range 300μm 300μm
XY Resolution 3.0μm 2.1μm
Bump Diameter(Min.) 25μm 18μm
Bump Pitch 55μm 36μm
Accuracy in Height 3σ AVE. + 3σ 3σ ≦ 2μm
Dimension (W)2,560mm×(D)2,715mm×(H)1,945mm

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